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TD62081~084APG/AFG
Toshiba Bipolar Digital Integrated Circuit Silicon Monolithic
TD62081APG,TD62081AFG,TD62082APG,TD62082AFG, TD62083APG,TD62083AFG,TD62084APG,TD62084AFG
8ch Darlington Sink Driver
The TD62081APG/AFG Series are high-voltage, high-current darlington drivers comprised of eight NP darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product.
Features
Output current (single output) 500 mA (max) (TD62081APG/AFG series) High sustaining voltage output 50 V (min) (TD62081APG/AFG series) Output clamp diodes Inputs compatible with various types of logic. Package type-APG: DIP-18 pin Package type-AFG: SOP-18 pin
Type TD62081APG/AFG TD62082APG/AFG TD62083APG/AFG TD62084APG/AFG
Input Base Resistor External 10.5-k + 7 V Zenner diode 2.7 k 10.5 k
Designation General purpose 14 V to 25 V PMOS TTL, 5 V CMOS 6 V to 15 V PMOS, CMOS
Weight DIP18-P-300-2.54D : 1.47 g (typ.) SOP18-P-375-1.27 : 0.41 g (typ.)
Pin Connection (top view)
O1 18 O2 17 O3 16 O4 15 O5 14 O6 13 O7 12 O8 COMMON 11 10
1 I1
2 I2
3 I3
4 I4
5 I5
6 I6
7 I7
8 I8
9 GND
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Schematics (each driver)
TD62081APG/AFG Input Output 3 k 7.2 k Common Input 7 V 10.5 k 3 k 7.2 k GND TD62084APG/AFG Input Output 10.5 k 3 k 7.2 k Common Output TD62082APG/AFG Common Input 2.7 k 3 k 7.2 k GND Output TD62083APG/AFG Common
GND
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings (Ta = 25C)
Characteristics Output sustaining voltage Output current Input voltage Input current Clamp diode reverse voltage Clamp diode forward current Power dissipation Operating temperature Storage temperature APG AFG Symbol VCE (SUS) IOUT VIN (Note 1) IIN (Note 2) VR IF PD Topr Tstg Rating -0.5 to 50 500 -0.5 to 30 25 50 500 1.47 0.96 -40 to 85 -55 to 150 Unit V mA/ch V mA V mA W C C
Note 1: Except TD62081APG/AFG Note 2: Only TD62081APG/AFG
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Recommended Operating Conditions (Ta = -40 to 85C)
Characteristics Output sustaining voltage Symbol VCE (SUS) Tpw = 25 ms, Duty = 10% 8 circuits Tpw = 25 ms, Duty = 50% 8 circuits Tpw = 25 ms, Duty = 10% 8 circuits Tpw = 25 ms, Duty = 50% 8 circuits VIN Test Condition Min 0 0 0 0 0 0 14 VIN (ON) 2.5 8 0 VIN (OFF) 0 0 IIN VR IF PD 0 Typ. Max 50 347 123 mA/ch 268 90 30 30 30 30 7.4 0.5 1.0 5 50 400 0.52 0.4 mA V mA W V V V Unit V
APG Output current AFG IOUT
Input voltage
Except TD62081APG/AFG TD62082APG/AFG
Input voltage (Output on)
TD62083APG/AFG TD62084APG/AFG TD62082APG/AFG
Input voltage (Output off)
TD62083APG/AFG TD62084APG/AFG
Input current
Only TD62081APG/AFG
Clamp diode reverse voltage Clamp diode forward current Power dissipation APG AFG
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Electrical Characteristics (Ta = 25C)
Characteristics Symbol Test Circuit Test Condition Ta = 25C Output leakage current ICEX 1 VCE = 50 V Ta = 85C VIN = 6 V VIN = 1 V IOUT = 350 mA, IIN = 500 A Collector-emitter saturation voltage VCE (sat) 2 IOUT = 200 mA, IIN = 350 A IOUT = 100 mA, IIN = 250 A TD62082APG/AFG TD62083APG/AFG Input current TD62084APG/AFG IIN (OFF) TD62082APG/AFG 4 IIN (ON) 2 VIN = 17 V VIN = 3.85 V VIN = 5 V VIN = 12 V IOUT = 500 A, Ta = 85C VCE = 2 V, IOUT = 300 mA VCE = 2 V, IOUT = 200 mA TD62083APG/AFG Input voltage (Output on) TD62084APG/AFG VIN (ON) 5 VCE = 2 V, IOUT = 250 mA VCE = 2 V, IOUT = 300 mA VCE = 2 V, IOUT = 125 mA VCE = 2 V, IOUT = 200 mA VCE = 2 V, IOUT = 275 mA VCE = 2 V, IOUT = 350 mA DC current transfer ratio Clamp diode reverse current Clamp diode forward voltage Input capacitance Turn-on delay Turn-off delay hFE IR VF CIN tON tOFF 2 6 7 8 RL = 125 , VOUT = 50 V RL = 125 , VOUT = 50 V VCE = 2 V, IOUT = 350 mA Ta = 25C Ta = 85C IF = 350 mA (Note) (Note) Min 50 1000 Typ. 1.3 1.1 0.9 0.82 0.93 0.35 1.0 65 15 0.1 0.2 Max 50 100 500 500 1.6 1.3 1.1 1.25 1.35 0.5 1.45 13 2.4 2.7 3.0 5.0 6.0 7.0 8.0 50 100 2.0 A V pF s V A mA V A Unit
TD62082 TD62084
Note: VR = VR max
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Test Circuit
1. ICEX
Open ICEX Open VIN VCE VCE, VCE (sat) hFE = IOUT IIN VIN IIN
2.
VCE (sat), hFE
Open IOUT
3.
IIN (ON)
Open IIN (ON) Open
4.
IIN (OFF)
IIN (OFF)
Open IOUT
5.
VIN (ON)
Open IOUT
6.
IR
IR Open VR
VIN (ON)
VCE Open
7.
VF
VF IF
Open
Open
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8. tON, tOFF
Input Open VOUT RL (Note 2) Input condition Output CL = 15 pF (Note 3)
Pulse generator (Note 1)
tr Input 90% 50% 10% tON Output 90% 50% 50 s
tf VIH 10% tOFF 0 VOH VOL
Note 1: Pulse width 50 s, duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: See below. Input condition
Type Number TD62081APG/AFG TD62082APG/AFG TD62083APG/AFG TD62084APG/AFG R1 2.7 k 0 0 0 VIH 3V 13 V 3V 8V
Note 3: CL includes probe and jig capacitance
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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IIN - VIN
3 TD62082APG 3 TD62083APG
IIN - VIN
(mA)
2 max
(mA)
2 max
IIN
Input current
typ. 1 min
Input current
IIN
1
typ.
min
0 12
16
20
24
0 2
3
4
5
Input voltage
VIN (V)
Input voltage
VIN (V)
IIN - VIN
3 TD62084APG 600
IOUT - VCE (sat)
(mA)
Output current IOUT
2
(mA)
400
Input current
IIN
typ. 200 25C max
max 1 typ.
min 0 5 7 9 11 0 0 0.5 1.0 1.5 2.0
Input voltage
VIN (V)
Collector-emitter saturation voltage VCE (sat) (V)
IOUT - VCE (sat)
600 IIN = 500 A 500
IOUT - Duty cycle
8 circuits active 400
(mA)
Output current IOUT
Output current IOUT
400
(mA)
Ta = 85C 200
300
200
25 -30
Ta = 25C
100
85
0 0
0.4
0.8
1.2
1.6
0 0
20
40
60
80
100
Collector-emitter saturation voltage VCE (sat) (V)
Duty cycle
(%)
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hFE - IOUT
10000 TD62083 5000 V CE = 2.0 V 3000 1000 500 300 100 50 30 10 5 3 1 85C -40 10000 TD62084 5000 V CE = 2.0 V 3000 1000 500 300 100 50 30 10 5 3 1
hFE - IOUT
DC current transfer ratio hFE
DC current transfer ratio hFE
85C -40 25
25
10
100
1000
10000
10
100
1000
10000
Output current
IOUT (mA)
Output current
IOUT (mA)
PD - Ta
2.0 (1) Type-APG Free air
(2) Type-AFG Free air
PD (W)
1.5
(1)
Power dissipation
1.0
(2)
0.5
0 0
50
100
150
200
Ambient temperature
Ta
(C)
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Package Dimensions
Weight: 1.47 g (typ.)
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Package Dimensions
Weight: 0.41 g (typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
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Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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